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Semiconductor eutectic vacuum reflow soldering

HSM series eutectic vacuum reflow soldering

1. This equipment is built on an imported platform, meticulously engineered, and features independent intellectual property rights. It is a semiconductor vacuum soldering system that breaks through international封锁 and monopoly.
The product is designed for vacuum chip packaging and soldering of SOP, SOT, DIP, QFP, BGA, IGBT TO, MINILED, and other applications.
2. This equipment adopts an industrial control embedded control system with dual-CPU computing, capable of operating independently without a connected PC (even if the PC crashes).
3. It is not only stable and reliable but also provides more precise temperature control.
4. Interchangeable heating modules are available for different customer products, effectively preventing solder splashing caused by temperature differences.
5. The exclusive patented Flux automatic recovery system reduces equipment maintenance and cleaning frequency.
6. The equipment supports recipe functionality for key soldering parameters and enables remote MES data retrieval.
7. The intelligent nitrogen monitoring and control system not only conserves protective gas but also achieves lower oxygen levels.
8. Staged vacuum evacuation design supports up to 5-step evacuation.
9. The patented water-cooled sealing ring structure offers longer service life, lower operating costs, and reduces expensive product damage caused by poor sealing.
10. Maximum vacuum level reaches 0.1 KPa, with Single Void <0.5% and Total Void <1%.
11. Fastest cycle time: 25s per cycle—the highest efficiency in the vacuum reflow soldering industry.
12. Warm-up time: approximately 30 minutes.
13. Perfectly compatible with ASM and domestic PB equipment.
14. Equipped with a formic acid leak alarm. In case of a minor formic acid leak, the main formic acid valve is automatically shut off. The remaining formic acid can also be fully reacted into water and carbon dioxide through a combustion method.
15. During normal production, formic acid decomposes into water and carbon dioxide under high temperatures and can be directly discharged into the atmosphere. If any formic acid remains, the combustion method can also fully convert it into water and carbon dioxide.

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