Welcome to the official website of Guangdong Huaxin Semiconductor Technology Co., Ltd

Product Center

Contact Us

You are here:Home >> Product Center >> Semiconductor vacuum formic a...

Semiconductor vacuum formic acid furnace

HPK series vacuum formic acid furnace

1. This equipment is developed and manufactured on an imported platform, targeting semiconductor power devices such as IGBT and other products that require vacuum soldering with solder paste or solder preforms.
2. This equipment adopts an industrial control embedded control system, which is not only stable and reliable but also provides more precise temperature control.
3. The equipment supports recipe functionality for key soldering parameters and supports SECS/GEM data exchange.
4. The equipment can automatically and visually adjust the vacuum pump‘s evacuation speed and set staged vacuum evacuation based on different products, preventing component shifting and solder ball formation during soldering.
5. The water-cooled sealing ring structure offers longer service life, lower operating costs, and reduces expensive product damage caused by poor sealing.
6. Maximum vacuum level reaches 0.1 kPa, with Single Void <1% and Total Void <2%.
7. The precise quantitative formic acid and nitrogen control system not only significantly saves nitrogen and formic acid but also effectively reduces residual formic acid emissions.
8. The equipment incorporates an automatic inspection system that can detect operating conditions in advance, predict potential failures, and eliminate faults proactively.
9. This equipment is a perfect replacement for PINK formic acid vacuum reflow soldering systems.

    Equipment Specifications

    Basic Parameters

    Model

    HPK-300

    Heating Method

    Metal heating platform, resistive heating, independent zone control, contact conduction heating.

    Heating Zones

    2

    Cooling Zone

    1

    Temperature Range

    Maximum temperature 400°C

    Heating Platform Uniformity

    ±3°C

    Ultimate Vacuum Level

    10 Pa

    Vacuum Chambers

    3

    Cooling Method

    Metal cooling platform with water cooling system, contact cooling for rapid temperature reduction.

    Loading Method

    Stepper motor controlled lifting; motor-driven feeding.

    Input Conveyor Height

    900mm ± 20mm, automatic conveyor operation for continuous production.

    Maximum Product Size

    280 × 410 mm

    Chamber Height

    80 mm

     

     

    Throughput (UPH)

    UPH ≤ 8min/set (continuous loading/unloading time); (HPD secondary soldering UPH ≤ 12min/set)

    Heating Platform Material

    High-polymer alloy material with special surface treatment.

    Void Rate

    Single < 1%, Overall < 3%

    Process Gases

    Nitrogen, formic acid gas, hydrogen

    Nitrogen Consumption

    Approx. 5 L/H

    Minimum Oxygen Level

    ≤ 50 ppm (with 99.999% purity nitrogen)

    Formic Acid Consumption

    Approx. 30–100 mL/H

    Power

    Maximum power: 35 kW; Operating power: 10–15 kW

    Control System

    Embedded industrial touch PC + PLC

    Operating System

    Linux system

    Power Supply Standard

    380V, 3-phase 5-wire, 10 mm² copper wire

    Dimensions

    L 3800 × W 1800 × H 1800 mm (L×W×H)

    Equipment Weight

    2600 kg

     

     

     

     

     

    Safety System

    Low temperature alarm, over-temperature alarm

    Vacuum level monitoring alarm

    Nitrogen supply fault alarm

    Cooling water pressure detection system, low pressure alarm

    Air pressure detection system, high/low pressure alarm

    Chamber door position detection

    One-button emergency heating power cut-off

     

     

     

    Hardware Configuration

    Main unit: 1 set

    Control system: 1 set

    Nitrogen control system: 1 set

    Formic acid reducing gas control system: 1 set

    Vacuum pumps: 3 units

    Automatic loading/unloading system: 2 sets

    Please call or leave a message, and we will get back to you as soon as possible!

    *

    *

    *

    *

Related products