Solution-Guangdong Huaxin Semiconductor Technology Co., Ltd. ,Vacuum Reflow Soldering Series, Vertical Curing Oven Series, Oven Series, SMT Full Line Solutio

Huaxin Semiconductor vacuum reflow soldering solution: solves the problem of IGBT high-temperature soldering, with bubble rate<2% and ...

In response to the industry pain points of high-temperature oxidation, high bubble rate, energy consumption and production capacity contradiction faced by semiconductor power devices (such as IGBT modules and SiC devices) welding, this article systemati...
Huaxin HXM-400 vertical curing furnace solution: three-dimensional heating empowers efficient manufacturing 编辑译文段落对照...

This article focuses on the vertical solidification furnace solution of Huaxin HXM-400, targeting semiconductors SMT、 The pain points of traditional curing processes in industries such as automotive electronics, such as large footprint, high energy c...