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Precision heating equipment

Silver paste dust-free and oxygen free oven

This equipment is designed for semiconductor silver paste heating, soldering, and sintering applications. The equipment adopts an embedded system, which is not only stable and reliable but also offers richer and more convenient communication interfaces.
The equipment supports recipe functionality for key soldering parameters and enables remote MES data retrieval.
This equipment features a unique horizontal + vertical airflow design. Unlike conventional airflow modules, it achieves smaller temperature deviations.
The equipment‘s heating system incorporates 3-level protection, effectively preventing product damage caused by over-temperature conditions.
The equipment features Class 10,000 cleanroom design, making it suitable for any cleanroom environment.
The equipment uses intelligent PID fuzzy logic control for heating, providing stronger thermal compensation capability and lower energy consumption.
The equipment comes with an integrated nitrogen system and cooling system.

    Main Technical Specifications

    No.

    Item

    Technical Specification

    1

    Equipment Configuration

    Dual-chamber, dual-control oven

    2

    External Dimensions

    1665 mm (L) × 1130 mm (W) × 1812 mm (H)

    3

    Single Chamber Internal Dimensions

    L 710 × W 780 × H 560

    4

    Weight

    1000 kg

    5

    Power Supply Requirements

    380 V, 50 Hz

    6

    Rated Power

    40 KW

    7

    Maximum Load Capacity per Shelf

    ≤50 kg

    8

    Product Curing Temperature

    60–250°C (freely programmable)

    9

    Curing Time

    Programmable according to product process requirements

    10

    Temperature Control Method

    PID closed-loop control + SSR drive

    11

    Temperature Control Accuracy

    Within ±3°C

    12

    Temperature Abnormal Alarm

    Over-temperature or under-temperature after stabilization

    13

    Heating Rate

    3–8°C/min

    14

    Cooling Rate

    3–5°C/min

    15

    Oxygen Concentration

    <200 ppm, HMI communication control, alarm on exceedance

    16

    Cooling Method

    Water cooling

    17

    Cooling Time

    ≤40 min

    18

    Cooling Water Flow Rate

    ≥11 L/min

    19

    Cooling Water Pressure

    5 KG

    20

    Parameter Storage

    Multiple production parameter sets and statuses can be stored

    21

    Compressed Air

    7 KG

    22

    Nitrogen Pressure

    7 KG

    Please call or leave a message, and we will get back to you as soon as possible!

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