1. This equipment is developed and manufactured on an imported platform, targeting semiconductor power devices such as IGBT, CILP, TO, and other products that require high-vacuum solder paste soldering.

2. This equipment adopts an industrial control embedded control system that can operate independently without a connected PC (even if the PC crashes). It is not only stable and reliable but also provides more precise temperature control.

3. The equipment supports recipe functionality for key soldering parameters and enables remote MES data retrieval.

4. Staged vacuum evacuation design supports up to 5-step evacuation.

5. The patented water-cooled sealing ring structure offers longer service life, lower operating costs, and reduces expensive product damage caused by poor sealing.

6. Maximum vacuum level reaches 0.1 kPa, with Single Void <1% and Total Void <2%.

7. The equipment incorporates an automatic inspection system that can detect operating conditions in advance, predict potential failures, and eliminate faults proactively.

8. This equipment is a perfect replacement for ETC vacuum reflow soldering systems.